Essemtec will demonstrate the Spider jet dispenser at IMAPS 2016 in Pasadena
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announced plans to exhibit in Booth #224 at IMAPS Pasadena, scheduled to take place Oct. 10-13, 2016 at the Pasadena Convention Center. Essemtec will demonstrate the new compact Spider jet dispenser. The Spider can utilize two dispensing valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and is easily adapted to your application.
The Spider occupies only 1 m² of floor space and features linear motor drives for high accuracy: 40 µm (3σ) at full speed. Job changeover is quick with intuitive CAD import and job preparation. Mapping of heights by laser technology enables 3D applications. A mineral-cast chassis provides stability at varying temperatures. Job and quality management is integrated. An optional ISO 7 cleanroom version is available.
The Spider is capable of a variety of semiconductor packaging applications including underfill for flip chip, dam and fill chip encapsulation, glob top and cavity fill, die bonding, lid seal, thermo-compression bonding, thermal grease, 2.5/3D packaging, and copper pillar packaging.