FINETECH to exhibit rework solutions at APEX 2017

FINETECH will exhibit the FINEPLACER Coreplus rework system in booth #2801 at the upcoming APEX exhibition, scheduled for February 14-16, 2017 at the San Diego Convention Center.

The FINEPLACER Coreplus offers proven rework technology for the complete rework cycle in one efficient design. Using a fixed vision alignment system, the Coreplus handles de-soldering, site dressing, paste print, re-balling and component replacement. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA).

The full-area Bottom Heating Module has been optimized for reworking medium sized PCBs of consumer electronics (tablets, laptops, gaming consoles) to medical technology products (lab-on-chip, microfluidics, chip-on-flex). Utilizing precise temperature and gas flow control of top and bottom heating, it‘s possible to rework high density packages without disturbing neighboring components.

Customers are invited to bring their devices to the Finetech booth for a personalized consultation.

www.finetechusa.com

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