Finetech to present production equipment for optical sub-assemblies at Semicon China 2017

Finetech from Berlin is a long-term technology partner for high-precision die packaging and advanced optoelectronics assembly. Over the course of 25 years, Finetech has evolved into a globally leading equipment manufacturer for R&D, prototyping and production needs.

One particularly demanding optoelectronic application is the assembly of modern communications modules. Finetech is serving customers from around the world who engage in the development and manufacturing of optical transceiver modules (TOSA/ROSA) with bandwidths from 25 G to 100 G. Even with 25 G modules, the maximum placement error is only ±5 µm in x and y and ±1 µm in z. The maximum angular error θ must not exceed ± 0.5°. All these specifications must be met post-bond.

Assembling optical transceiver modules is a multi-step process which presents a number of challenges. The laser diode arrays must be aligned to the PD array with highest (post-bond) accuracy. Optical active surfaces are touch-free zones, therefore specialized tooling is required to handle the component. There is the need to work in different focal planes. And finally you need to be able to use different bonding technologies like gluing, fluxless soldering or thermocompression with variable process parameters to be able to build the entire optical transceiver module on the same machine.

Fully Automated Opto-Bonder® Supports Complete Transceiver Assembly Process
With the fully automated Opto-Bonder®, the company offers a sub-micron die bonder perfectly suited for the production-scale assembly of optoelectronic sub-modules and other state-of-the-art optoelectronic devices.

This field approved system with excellent cost/performance ratio offers a tailored solution for the complete high-precision assembly of products like 40G/100G transceiver modules, AOC or industry high power lasers. The precision bonder can be flexibly equipped for VCSEL, PD array or lens assemblies. It is the ideal system for the automated product and process development as well as volume production.

The Opto-Bonder® is capable of handling component sizes from 0.05 x 0.05 mm² to 100 x 100 mm² and supports wafer sizes up to 12”. A wide range of applications can be handled, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode array bonding (gluing, curing), the assembly of lenses, mirrors or filters, and the multi-stage assembly of micro-opto-electro-mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.


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