Finetech/Martin introducing new rework and dispense solutions at IPC APEX 2016

Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.The Dotliner 07 is an automatic, solder paste and SMT adhesive dispenser capable of dispensing 100 micron dots repeatably. Regardless of whether liquid or paste-like materials are dispensed, no retrofitting of the device is required. The Dotliner 07 features easy dispense wizard software, closed-loop pressure and temperature control in a small footprint and table-top design.


There will be two new manual dispensers on display that offer a compact package and user display. The Clever Dispense 06 has high speed valves that enable the dispenser to accurately and reliably produce less than 200µm dots and lines. Clever Dispense 06 handles a wide range of viscosities (alcohols to silicones). The Smart Dispense 06 provides accuracy and repeatability at a superior value with a closed-loop pressure control. Nozzle heating and vacuum retract are available as optional features.

emo__0012_Layer_8_04_a8b2ddcb86The MiniOven 05 is the latest version of this popular reballing and prebumping system, with technical innovations that result in increased performance and operating simplicity. This stand-alone unit reballs micro-BGAs, BGAs and BGA Sockets and prebumps QFNs and leadless devices. Updated firmware provides enhanced process capability and temperature stability, while a new external thermocouple allows closed loop profiling.

Also on display in the booth, the Fineplacer® Core system for advanced rework applications and the Martin 10.6 HXV for large board rework.


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