Henkel to showcase Loctite® GC 10 success alongside distributor, AAT Aston, at SMT Hybrid Packaging 2016
Henkel Adhesive Technologies’ Electronics business will highlight the success of its temperature stable Loctite® GC 10 solder paste at the upcoming SMT Hybrid Packaging event, taking place from April 26-28 in Nuremberg, Germany. The company will exhibit with its Central European distributor, AAT Aston GmbH (Aston), in Hall 7, Booth 349 and showcase how the strong, 20-year Henkel-Aston partnership and the unprecedented performance of Loctite GC 10 have accelerated adoption of the material with customers in the region.
Introduced in early 2015, Loctite GC 10 is the market’s first and only lead-free, halogen-free, temperature stable solder paste. The material’s temperature stability has advantages in numerous areas – from logistics and storage to printing and reflow performance – boasting stability at 26.5°C for one year and at temperatures as high as 40°C for one month. With a fast start-up time, abandon times of 24 hours, proven consistent print transfer efficiency, high Cpk even with exceptionally small apertures, and an expanded reflow window, Loctite GC 10 is matchless among competitive materials.
“The processabilty and performance of Loctite GC 10 are true game-changers for advanced electronics assembly operations,” notes Richard Boyle, Global Technical Champion for Henkel’s Electronics business. “Improved production yields, 95% paste utilization and the ability to eliminate expensive cold-pack overnight shipping and refrigerated storage make the material remarkably cost-effective. We are looking forward to sharing successful case histories and the proven benefits of Loctite GC 10 with SMT Nuremberg show delegates.”
Customers throughout Aston’s Central Europe distribution region appreciate the performance difference delivered by Loctite GC 10, and the company’s joint efforts with Henkel have led to quick expansion and sales growth. Since its introduction, nearly 100 Central European customers across market sectors as diverse as industrial, automotive and mass transit have selected Loctite GC 10 as their preferred solder paste for advanced electronics assembly.
In addition to technical discussions on the Aston stand, SMT Nuremberg visitors who are interested in learning more about the technology behind Loctite GC 10’s expanding success are invited to attend the “Room Temperature Stable Solder Paste” presentation by Henkel technologist, Richard Boyle, on Tuesday, April 26th at 1:30 p.m. at the trade show forum, Hall 7A-335.
To schedule an appointment, send an e-mail to email@example.com. For more information about Loctite GC 10, visit www.soldergamechanger.com. Details regarding Henkel’s full portfolio of electronic material solutions are available on www.henkel-adhesives.com/electronics