Hentec/RPS to Participate at SMTA Wisconsin Expo & Tech Forum on September 14th

Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.

Hentec Industries/RPS Automation announces that it will exhibit its full line of selective soldering, component lead tinning and solderability test equipment at the upcoming SMTA Wisconsin Expo & Tech Forum to be held at the Milwaukee Crowne Plaza, in Milwaukee, Wisconsin on September 14, 2021.

At the SMTA event, Tom Baro, National Sales Manager for Hentec/RPS will be on-site to discuss how Hentec/RPS selective soldering, component lead tinning and solderability test equipment can improve the production quality of your printed circuit board assembly operation.  The Vector and Valence selective soldering systems feature unlimited program storage, integrated system software, witness camera and auto fiducial correction.  Available in either standalone or SMEMA in-line configurations, the Vector and Valence are offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles.  All Vector and Valence systems are UL and CE certified and carry both a two-year system warranty and a four-year solder pot warranty.  

Hentec/RPS Odyssey robotic hot solder dip machines are MIL spec complaint component lead tinning machines designed for gold removal, re-tinning applications, including high reliability and military applications as well as BGA de-balling.  The Pulsar solderability test system features a dip-and-look qualitative test method to verify the solderability of the surface of electronic components and can be easily performed by shop floor personnel with minimal training.

www.rpsautomation.com

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