Indium Corporation Announces Low-Temp Solder Seminar at LEAP Expo

Indium Corporation’s Anson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China.

Low-temperature soldering is not a “one alloy fits all” solution. Depending on the application, the actual temperature required for low-temperature soldering can vary widely. In Low-Temperature Solder Innovation—Durafuse™ LT and the Low- to Mid-Temperature Space, Yu will examine Durafuse’s ability to bring mid-temperature drop shock properties into the upper edge of the low-temperature space, as well as low-temperature solder’s specific process limitations and lifetime requirements.

Yu is the Technical Manager for Global Accounts in Asia and is based at Indium Corporation’s Suzhou facility. He is responsible for coordinating and managing technical service and resources to multinational accounts in Asia. He also assists with new business development, new product development, and technical resolutions. Yu has more than 10 years of manufacturing and equipment engineering experience. Prior to joining Indium Corporation, he was an Operations Engineering Manager, overseeing profit and loss indicators, process engineering, and equipment engineering. Yu earned his bachelor’s degree in electrical engineering from Nanjing Institute of Technology and his master of business administration from Wuhan University.

LEAP Expo—co-organized by Messe Muenchen Shanghai Co., Ltd., Chinese Optical Society-Laser Processing Committee, and China Machine Vision Industry Union—is comprised of five exhibitions: Automation & Robotics, productronica South China, South China Advanced Laser Technology and Application Exhibition, electronica South China, and VisionChina (Shenzhen).

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