Indium Corporation Expert to Present at CSPT 2018
It is well known that lead-containing materials can have harmful effects on human health and the environment. Furthermore, emerging high power semiconductor devices and modules serving high current and high junction temperatures of 150°C or higher require more reliable materials with high thermal conductivity. Considering these two challenges, Indium Corporation has started the exploration into high-temperature lead-free materials to help promote and support the industry’s progress toward lead-free
Dr. Zhang’s presentation, Lead-Free Bonding Materials for Power Semiconductor Die-Attachment, examines die-attach material alternatives for these emerging, high-power semiconductor devices. Balancing materials’ reliability and cost, Zhang outlines potential alternatives, including solder and diffusion bonding materials.
Dr. Zhang joined Indium Corporation in 2008 as a Research Metallurgist responsible for the development of new high-temperature lead-free solders. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique, which was the basis for developing the BiAgX® solder system. He has published more than 20 papers and journal articles. He received his PhD in material science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University. Dr. Zhang holds a Lean Six Sigma Green Belt and is IPC-A-600 and IPC-A-610D trained.
During the show, Indium Corporation will feature those products referenced during Dr. Zhang’s presentation, BiAgX® and NC-SMQ®75, at its booth, as well as other advanced materials for semiconductor packaging.