Indium Corporation Expert to Present at CSPT

Shrinking stencil apertures and gaps between pads have necessitated more critical solder paste printing requirements. Indium Corporation’s Leo Hu, senior area technical manager, will cover these conditions and more when he presents on ultrafine feature solder paste printing for system-in-package (SiP) at CSPT, Nov. 22-24, Jiangyin, Jiangsu Province, China.

Increased functionality, higher performance, faster time to market, lower cost, increasing miniaturization requirements on SiP passives, and the maturation of heterogeneous integration are just a few of the driving forces behind more critical solder paste printing requirements.

 

In Application of Ultrafine Feature Solder Paste Printing for System-in-Package, Hu will:

  • Cover Type 6 and Type 7 ultrafine-pitch solder paste printing
  • Share SPI data addressing different area ratios that explain the influence of powder size, flux vehicle vs. area ratio, and printing performance
  • Discuss the application of water-soluble paste

 

Hu will also discuss a related case study and Indium Corporation’s new offering—SiPaste® C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing.

 

Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a master’s degree in IC engineering from the Chinese Academy of Science, and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.

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