Indium Corporation expert to present at Electronic Components and Technology Conference
Indium Corporation expert, Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Institute of Electrical and Electronics Engineers (IEEE) 68th Electronic Components and Technology Conference (ECTC) from May 29 to June 1 in San Diego, California, USA.
Dr. Lee will lead the professional development course, Achieving High-Reliability of Lead-Free Solder Joints—Materials Considerations. The course is designed to help attendees understand the various factors of materials, thus enabling the best selection of the proper solder alloys and surface finishes for achieving high-reliability solder joints.
Dr. Lee will present Nano-Cu Sintering Paste for High Power Devices Die Attach Applications. The paper examines how a nano-Cu pressureless sintering paste, developed specifically for joint formation applications, performed when subjected to a variety of tests for oxidation resistance.
Dr. Lee is also presenting Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications. His interactive presentation reports on the development, testing, and results of Indalloy®276, a lead-free solder alloy created to target wide service temperatures with high reliability.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
A paper co-authored by Indium Corporation’s Francis Mutuku, Research Metallurgist, will also be presented at the conference.
For more information about Indium Corporation’s experts and their work, visit http://www.indium.com/techlibrary