Indium Corporation expert to present at International Electronics Manufacturing Technology Conference

Indium Corporation expert, Dr. Ning-Cheng Lee, Vice President of Technology, will deliver two presentations and lead a course at the 38th International Electronics Manufacturing Technology (IEMT) Conference in Melaka, Malaysia on September 4-6.

Dr. Lee will present Assessment of Solder Paste Technology Limitation in Miniaturization for SiP and SMT Applications. The paper examines the performance of solder paste in producing a strong joint by analyzing pitch dimension, powder size, residue levels, flux capacity, oxygen barrier, alloy dopants, and more.

Dr. Lee will also present Nano-Cu Sintering Paste for High-Power Devices in Die-Attach Applications, which details the development of a nano-Cu sintering material that enables the pressureless process needed for small chips and combats the oxidation typically seen with Cu-materials during storage and handling.

Electromigration – The Hurdle for Miniaturization and High-Power Devices is a three-hour course designed to help attendees achieve long solder joint life under high-stress conditions. It will cover all critical aspects of electromigration in solder joints, including failure mechanisms, effects of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, temperature, current polarity, and more.

Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and an IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, as well as in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.

For more information about Indium Corporation’s experts and their work, visit http://www.indium.com/techlibrary

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