Indium Corporation experts to present at SMTA’s South East Asia Technical Conference 2017

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and other company experts will present at SMTA’s South East Asia Technical Conference on Electronics Assembly Technologies 2017, March 28-30, in Penang, Malaysia.

Dr. Lee will instruct a two-part seminar on Choosing Solders for the New Era on Tuesday, March 28. Part one will take place from 8:30 a.m. to noon and focus on lead-free solder alloys, and part two will run from 1:30-5 p.m. and discuss low-temperature solders.

Jonas Sjoberg, Technical Manager, will chair the Advanced Packaging session on Thursday, March 30.

Technical presentations by Indium Corporation experts include:

Voiding Control at LED Die-Attach Preform Soldering by Dr. Lee
Assessment of Solder Paste Technology Limitation for Printing Applications by Dr. Lee
Process Optimization for Cold Joint and Tombstone Improvement in SiP Package by Jason Chou, Area Technical Manager – Taiwan
System-in-Package (SiP) Assembly vs. Solder Paste Attributes by Kenneth Thum, Senior Technical Support Engineer
For more information on the technical sessions offered at SMTA’s South East Asia Technical Conference, visit


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