Indium Corporation Experts to Present at IPC APEX Expo
The following technical papers from Indium Corporation experts will be featured:
- Fluxes Suppressing Non-Wet Opens at BGA Assembly by Dr. Ning-Cheng Lee, Vice President of Technology
- An Investigation of the Mystery of DPAK Voiding by Kimberly Flanagan, Technical Support Engineer
- Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA? by David Sbiroli, Technical Manager, Global Accounts
Dr. Lee will also lead the professional development course entitled Achieving High-Reliability for Lead-Free Solder Joints: Materials Consideration.
Indium Corporation experts will further serve as chairs for three technical sessions: