Indium Corporation experts to present at SMTAI 2018

Indium Corporation experts will share their industry knowledge and skill at SMTA International from Oct. 14-18 in Rosemont, Ill.

The following technical papers from Indium Corporation experts will be featured:

Robust SMT No-Clean Solder Paste for SiP and 01005 Assembly by Dr. Ning-Cheng Lee, Vice President of Technology
Low-Melting Point Materials Development: Novel High Reliability Low-Temperature Solder Alloys by Dr. Ning-Cheng Lee
Novel High-Reliability Low-Temperature Solder Alloys by Dr. Lee
Process and Materials Interaction Investigation: Test Methods for Electrochemical Consistency in PCB Assembly Processes – Revisited by Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials
Solder Paste Rheology, Performance and Aging: How Worst-Case Shipping Scenarios Affect Solder-Paste Performance: Part 2 by Brook Sandy-Smith
Reflow Profiling for Next-Generation Pb-free Solder Alloys by Brook Sandy-Smith
Inspection Applications: Practical Implementation of Assembly Process for Low-Melting Point Solder Pastes by Brook Sandy-Smith
Solder Printing: Impact of Stencil Quality & Technology on Solder Paste Printing Performance by Jonas Sjoberg, Technical Manager
Reliability of Intermetallics in Various Interconnects: Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature by Dr. Ron Lasky, Senior Technologist
Indium Corporation experts will also serve as chairs for three technical sessions, including:

Solder Paste Development to Overcome Component Challenges: Adam Murling, Technical Support Engineer, Global Accounts
Low-Temperature Solder Paste and its Process Development – iNEMI Project: Anny Zhang, Regional Sales Manager, Northwestern USA, and Western Canada
Properties and Behavior of Solders Containing Bismuth: Brook Sandy-Smith
Additionally, Dr. Lee will lead a workshop on Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration, and Brook Sandy-Smith will host Rising Expectations for “High-Reliability”—a spotlight series panel discussion.

SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world’s leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

www.indium.com

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