Indium Corporation to feature Indium8.9HF and Indium10.1 solder pastes at NEPCON China 2017
Indium Corporation will feature its void-reducing Indium8.9HF and Indium10.1 Solder Pastes to help customers Avoid the Void® at NEPCON China 2017 from April 25-27, in Shanghai.
Both Indium8.9HF and Indium10.1 deliver excellent response-to-pause printing performance, and remain stable for 30 days at room temperature and up to 12 months when refrigerated. These solder pastes are also equipped with a unique oxidation barrier technology that makes them perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, visit www.indium.com/avoidthevoid.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.