Indium Corporation features InFORMS® reinforced solder preforms at APEC 2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2017, March 26-30, in Tampa, Fla.

InFORMS are reinforced solder preforms that increase lateral strength and stability. As a result, improved thermal cycling reliability can be achieved.

In one study where InFORMS were used to solder a DBC to the baseplate of an IGBT, the following were achieved:

4x improved thermal cycling reliability compared to a solder preform-only approach
2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
Low-voiding of <1% Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment For more information about InFORMS, visit www.indium.com/informs or visit Indium Corporation at booth #525. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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