Indium Corporation to present at NEPCON Vietnam 2016

Indium Corporation experts will share their knowledge and expertise at NEPCON Vietnam, Oct. 6-8, in Ho Chi Minh City, Vietnam.

Jonas Sjoberg, Technical Manager, will present DfX for High-Density Assemblies, which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR).indium_jonas-sjoberg

Participants will learn the importance of understanding process and design and how they impact manufacturing yields, reliability, and total cost. Lessons will include real-world case studies, with fundamental consideration and mechanisms of challenges well illustrated.

James Duong, Area Technical Manager, Vietnam, will discuss how to Avoid the Void™. Voiding reduces the electrical conductivity and physical strength of the solder joint and interferes with the component’s thermal management capabilities. Indium Corporation researched this defect extensively and, as a result, created Indium10.1 and Indium8.9HF solder pastes to minimize voiding and increase product reliability.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

www.indium.com

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