Indium Corporation to Feature AuSn Solder Preforms at NEPCON Japan 2019

IndiumGoldPreforms.pngIndium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48thNEPCON Japan, Jan. 16-18 in Tokyo, Japan.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to get smaller, with increasing power density and power ratings.

Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making it compatible with subsequent reflow processes. Additionly, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.

Indium Corporation’s Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs.

For more information about Indium Corporation’s AuSn solder preforms, see our experts at the show or visit www.indium.com/gold

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