Indium Corporation to Feature Low-Voiding Solder Pastes at SMTA International 2018

>Indium Corporation will feature its suite of void-reducing, no-clean solder pastes to help customers Avoid the Void® at SMTA International from Oct. 14-18 in Rosemont, Illinois.

Indium Corporation’s suite of solder pastes, including Indium8.9HF and Indium10.1, are specially formulated to deliver ultra low-voiding, plus enhanced benefits such as improved response-to-pause, stability, head-in-pillow (HIP) minimization, reliable in-circuit testing, and enhanced SIR performance.

www.indium.com

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