Indium Corporation’s Indium10.1HF Solder Paste Wins Mexico Technology Award

Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste.

The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year.

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The awards are designed to promote best practices in technical innovation, manufacturing quality, and productivity by celebrating the companies and people achieving high standards and driving the industry forward.

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.

In addition to the ultra-low voiding, Indium10.1HF is engineered with a unique flux chemistry to improve reliability and address the challenges of the industry’s trend toward miniaturization, including:

  • High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
  • Solder beading minimization
  • Very low bridging, slump, and solder balling
  • Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
  • High print transfer efficiency with low variation

To learn more about Indium10.1HF, visit http://www.indium.com/avoidthevoid or contact an Indium Corporation representative directly at askus@indium.com.

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