Inventec introduces two new lead free solder paste formulas
Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.
Ecorel Free 305-16LVD is a No Clean, lead free solder paste developed to achieve ultra low voiding and reduce the size of voids, especially in large area components such as power discretes, LEDs and QFNs. It is a halogen free ROL0 flux system; available is powder size type 3 and 4. It has been recently selected to be used in new generation electronics modules for a global German automotive OEM.
The main benefits of Ecorel Free 305-16LVD include:
• Ultra low voiding percentage and reduced void size
• Very good wetting on any surface finish
• Transparent colourless residue
• Good first pass yield pin testability
• It can be processed under air or nitrogen reflow atmospheres
Ecorel Free 305-16LVD is available worldwide in different packaging options.
Inventec presents its new products at productronica 2017, hall A1, booth 417.