IPC extends deadline on call for participation for IPC APEX EXPO 2019

Deadline for technical conference paper abstracts extended to: June 29, 2018

Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium, MacDermid-Enthone, Northrop Grumman, Oracle and Robert Bosch have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

3D Printing in Electronics Manufacturing
Automation in Electronics Manufacturing
Adhesives
Advanced Technology
Area Array/Flip Chip/0201 Metric
Assembly and Rework Processes
BGA/CSP Packaging
Black Pad and Other Board Related Defect Issues
BTC/QFN/LGA Components
Business & Supply Chain Issues
Cleaning
Conformal Coatings
Corrosion
Counterfeit Electronics
Design
Electromigration
Electronics Manufacturing Services
Embedded Passive & Active Devices
Environmental Compliance
Graphene in Electronics Manufacturing
Lean Six Sigma
LED Manufacturing
Failure Analysis
Flexible Circuitry
HDI Technologies
Head-on-Pillow
Board and Component Warpage
High Speed, High Frequency & Signal
Industry 4.0
Integrity
Lead-Free Fabrication, Assembly & Reliability
Miniaturization Nanotechnology Optoelectronics
Packaging & Components
PCB Fabrication
PCB and Component Storage & Handling Performance
Quality & Reliability
Photovoltaics
PoP (Package-on-Package)
Printed Electronics
Reshoring
RFID Circuitry
Robotics
Soldering
Surface Finishes
Test, Inspection & AOI
Tin Whiskers
2.5-D/3-D Component Packaging
Underfills
Via Plugging & Other Protection
Wearables

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

Technical conference paper abstracts are due June 29, 2018; to submit an abstract visit www.IPCAPEXEXPO.org/CFP

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