IPOWER3 – Electronic Packaging for net zero

IPOWER3 – ELECTRONIC PACKAGING FOR NET ZERO

One Day Conference on Thursday 2nd December 2021 at the Advanced Propulsion Centre, University of Warwick

IMAPS-UK invites Abstracts which describe the latest advancements in electronic package design, materials, processes, next level integration and performance while maintaining reliability, sustainability, manufacturability and cost-competitiveness in power generation, conversion, distribution and energy storage applications.

Conference Topics – iPower3

Materials – Semiconductor and Passive Devices

  • Packaging and Interconnect
    Power Generation, Conversion and Distribution
    Energy Strorage
    SiC Devices
    GaN devices
    Si Devices
    Emerging WBG Devices
    Capacitors
    Inductors
    Resistors
    Other Passive Devices

Packaging and Interconnect

  • Die Attach
    Sintering
    Wire/ribbon Bonding
    Laser Welding
    Encapsulation
    Embedding Devices
    Novel Materials
    Thermal Management

Power Generation, Conversion and Distribution

  • Module Characterisation
    Environmental Testing
    Lifetime and Reliability Prediction
    Degradation and Failure Mechanisms
    Switching Performance
    Recycling and Sustainability

Energy Storage

  • Batteries
    Fuel Cell
    Hydrogen
    Ammonia

THOSE WISHING TO PRESENT THEIR WORK AT IPOWER3 SHOULD SUBMIT AN ABSTRACT OF 200-300 WORDS BY FRIDAY 10TH SEPTEMBER 2021, ELECTRONICALLY TO: OFFICE@IMAPS.ORG.UK

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