KYZEN to present innovations to address the challenges of cleaning highly dense electronic hardware at IEMT-EMAP 2016

KYZEN is pleased to announce plans to exhibit and present during the conferences at IEMT-EMAP 2016, scheduled to take place Sept. 20-22, at the G-Hotel in Penang, Malaysia. KYZEN Sdn Bhd’s Technical Sales Manager, TC Loy, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”kyzen-tc-loy

The miniaturization of modern electronics decreases conductor widths, which can create higher risk to insulation failure. As distances between conductors are reduced, electronic hardware is more vulnerable to insulation failure, higher voltage gradients and easier to form a corrosion cell. Inter-conductor spacing influences the migration rate and is inversely related with conductor width. Acceleration factors create multiple stresses due to activation energy, temperature, humidity and voltage.

Removal of process residues is needed to reduce electrochemical migration. Cleaning electronic hardware is well-known. The challenges with cleaning highly dense hardware are many. Low standoff gaps prevent flux outgassing and can underfill the bottom termination with active flux residue. Mixed metals can react with alkaline cleaning agents, which can result in galvanic corrosion. The time and energy needed to reach the residue and remove contamination under the component requires high pressure spray impingement and increased wash time.

The purpose of this research is to present cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Mr. Loy will present the material compatibility on mixed metals, cleaning performance and Surface Insulation Resistance of the residue under the bottom termination.

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