KYZEN to show cleaners for wafer bumping, wire bonding and Cu pillar flip chip applications at SEMICON West

20160621 KYZEN SEMICON West 16KYZEN announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.

MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages.

Ionox® FCR High Strength Semi-Aqueous Electronics Cleaner is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. A major benefit of Ionox FCR is its complete water solubility. This enhances the ease of rinsing and removal of ionic contamination.

Ionox® FCR is buffered to maintain a stable pH over a wide level of flux loading. The flash point of this product ranges from 163-183°F, depending on the flash point method used. Ionox® FCR has been used within industry for more than 20 years and has a long heritage of successful use.

MICRONOX® MX2707 is designed for the demanding cleaning challenges presented by leadless devices such as BGAs, Flip Chips, QFNs, LGAs and passives. It has been optimized to remove organic acid residues of all kinds at low operating concentrations.

MICRONOX® MX2302, MICRONOX® MX2707 and Ionox® FCR are available in one, five, and 55 gallon (five, 25 and 200 liter) containers.

KYZEN®, MICRONOX® and Ionox® are registered trademarks in the United States and other countries.

www.kyzen.com

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