KYZEN’s MICRONOX MX2707 is designed for demanding cleaning challenges
KYZEN announced plans to exhibit in Booth #5976 at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature MICRONOX® 2707 for Cu pillar flip chip applications.
2017 was a banner year for the semiconductor industry. Sales boomed and significant opportunities emerged, driving near-record growth across every sector. However, with today’s ever-changing global business environment, uncertainty looms over the industry outlook. SEMICON West is where the industry goes to keep up with developments in a world that is rapidly moving BEYOND SMART.
MICRONOX MX2707 is designed for the demanding cleaning challenges presented by leadless devices such as BGAs, Flip Chips, QFNs, LGAs and passives. It is optimized to remove organic acid residues of all kinds at low operating concentrations.
MX2707 is a multi-metal safe cleaning chemistry for advanced packaging. Used at low concentrations, MX2707 is safe on exposed metal and effectively cleans under highly dense die.
KYZEN provides world-class cleaning chemistries and cleaning technology from front- to back-end applications. Visit KYZEN’s booth to discover how the company’s innovative solutions can help you achieve your product requirements. For more information about KYZEN, visit www.KYZEN.com