KYZEN’s T.C. Loy to present Electronic Assembly Cleaning Fluid Innovations at SMTA Penang
KYZEN is pleased to announce that it will exhibit and present at the SMTA Penang Vendor Show, scheduled to take place Sept. 23, 2016 at the Eastin Hotel Penang. T.C. Loy, KYZEN Sdn Bhd’s Technical Sales Manager, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”
The purpose of this research is to present cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Material compatibility on mixed metals, cleaning performance and Surface Insulation Resistance of the residue under the bottom termination will be presented.
The miniaturization of modern electronics decreases conductor widths, which can create higher risk to insulation failure. As distances between conductors are reduced, electronic hardware is more vulnerable to insulation failure, higher voltage gradients and easier to form a corrosion cell. Inter-conductor spacing influences the migration rate and is inversely related with conductor width. Acceleration factors create multiple stresses due to activation energy, temperature, humidity and voltage.
Removal of process residues is needed to reduce electrochemical migration. Cleaning electronic hardware is well-known. The challenges with cleaning highly dense hardware are many. Low standoff gaps prevent flux outgassing and can underfill the bottom termination with active flux residue. Mixed metals can react with alkaline cleaning agents, which can result in galvanic corrosion. The time and energy needed to reach the residue and remove contamination under the component requires high pressure spray impingement and increased wash time.