Launching aerolam – Base-Material Solutions for Aerospace Electronics

We’re looking forward to Productronica 2021 (16-19 November) where we’ll be launching ‘aerolam’ – a base material solutions set specifically curated for the diverse and unique requirements of aerospace and military applications.

Will you be there too? We’d love to welcome you to our booth in hall B3 #222.
If you can’t make it this time, but are interested in finding out more, please get in touch.

The evolution of aerospace and defense (A&D) electronics is accelerating at a staggering pace, driving the demand for reliable high-performance materials that maintain mechanical and electrical integrity in harsh mission-critical operating conditions.

Whatever the substrates must handle – high-speed digital signals, high RF frequencies, intense heat dissipation, extreme environmental stresses – the aerolam portfolio guides designers and manufacturers of high-performance A&D electronics to high-quality products that are ready to meet those demands and are supported by all the necessary documentation including test schedules and certificates of conformity.

The aerolam portfolio caters for the complete spectrum of A&D application scenarios, from equipment intended to operate in a relatively benign environment such as inside a command-and-control center, to high-performance fielded systems that must withstand the toughest conditions including extreme temperatures, high vibration and g-forces, salt spray, and humidity that challenge reliability to the utmost.

The Ventec team will be on hand for the launch and to showcase our unique laminate & prepreg capability across a very wide range of applications and budgets.

 

Materials Highlights

tec-speed 20.0 & tec-speed 30.0 – prepregs and laminates that are engineered to preserve signal energy and aid the fight against noise. Leveraging the latest knowledge in low-loss materials, Ventec’s most advanced formulas meet IPC 4103 specifications and provide the foundation for multi-GHz applications up to V/W-band and millimeter-wave frequencies.

tec-thermal – IMS families, laminates and prepregs designed for excellent thermal performance. Formable VT-4B1 and selective-preference VT-4B5SP extend choice and design freedom even further.

tec-pack – IC Package Substrates. Our advanced technology materials deliver the properties & performance demanded by today’s light weight, ever-thiner and smaller advanced function devices such as smart phones, laptops, wearables and special mil-aero applications.

VT-901 – Where mechanical strength and high-temperature stability are critical, VT-901, a UL-94 V-0 rated polyimide substrate has high flex strength, high glass temperature (Tg), low Z-axis CTE, and long T260 and T288 times – to maintain dimensional stability and integrity even under harsh loads.

VT-90H – A non-brominated, cost effective high-reliability polyimide that delivers the high-temperature capabilities, high fracture toughness, low Z-axis CTE, and UL-94 flammability HB rating that ensures compliance with defense and aerospace standards worldwide.

VT-447V – A halogen-free phenolic laminate/prepreg that combines high resistance to conductive anodic filament (CAF) formation with low Z-axis CTE, high Tg, and 150°C Maximum Operating Temperature (MOT). VT-447V offers excellent thermal-cycling performance and mechanical stability.

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