MacDermid Enthone advanced electronics solutions to Present at the 2018 IMAPS International Conference
MacDermid Enthone Electronics Solutions (MEES), a MacDermid Performance Solutions business, will present at the 51st International Symposium on Microelectronics – IMAPS 2018. The conference will be held October 8-11, at the Pasadena Convention Center, Pasadena, CA, USA.
Eric Gongora, General Manager Americas and Europe and Strategic Marketing Director of Wafer Level Packaging, MacDermid Enthone Advanced Electronics Solutions (AES), will address the continuous challenges faced in developing advanced packaging electroplating chemistries required to meet the performance, operational efficiency and time to market demands driven by the need for higher level of integration and heterogeneous solutions. Eric will present his paper; “Customization of Chemistry Continues“, on Wednesday, October 10 Session 118 at 11:00am. Eric will also serve as Session Chair for the Wafer-level Fan Out segment of the conference.
AES, a segment within the MEES business, is a global leader in high performance semiconductor chemistries and assembly materials. AES engages directly with OEMs, IDMs, wafer foundries, OSATs and tool suppliers to collaboratively develop solutions that meet the fast paced semiconductor market demands.
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