MacDermid Enthone Electronics Solutions to showcase next generation ENIG, Via Fill, and through hole fill processes at SMTA Booth 1228
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, will exhibit at SMTA International 2017, September 19-20 in Rosemont, IL. SMTA International is a four day technical conference, including workshops as well as a full exhibition. MacDermid Enthone Process Specialists will be on hand to discuss the chemistries and materials we offer throughout the entire electronics supply chain. Products showcased will be the next generation Affinity ENIG 2.0 – a high reliability electroless nickel immersion gold process, the MacuSpec Via Fill portfolio of via filling acid coppers, and Systek Through Hole Fill for advanced thermal management of IC packages. These technologies are part of a suite of processing solutions that serve the electronics manufacturing supply chain at every step, from device design, through circuit board production, semiconductor metallization, component assembly, and OEM specification. Stop by MacDermid Enthone Electronics Solutions booth #1228, and our sister company, Alpha Assembly Solutions, booth #1016.