MacDermid Enthone to Co-Exhibit with Alpha Assembly Solutions at 2018 NEPCON Japan 2018

WATERBURY, Conn, USA, December 15, 2017 – MacDermid Enthone Electronics Solutions will exhibit its latest range of chemical solutions, alongside its sister company Alpha Assembly Solutions, at the 2018 NEPCON Japan show. NEPCON is Asia’s Largest Exhibition for Electronics Design, R&D and Manufacturing Technology to be held in Tokyo, January 17-19, 2018.

At the show, MacDermid Enthone Electronics Solutions will showcase its chemical processes for printed circuit boards and IC substrates, including PackagePrep solderable finish for QFN sidewalls, PackageBond leadframe adhesion promoter, MacuSpec electrolytic coppers, Systek through hole fill and Affinity ENIG final finish. In addition, MacDermid Enthone’s Advanced Electronics Solutions business will display offerings for the semiconductor manufacturing sector. Products include ViaForm, the industry’s most trusted Copper Damascene, and a complete offering of wafer level packaging products from the MICROFAB line.

MacDermid Enthone Electronics Solutions, Advanced Electronics Solutions, Alpha Assembly Solutions and Alpha Advanced Materials are in the unique position to combine their technology, innovation and service capabilities, resulting in a new industry leader in all materials for Advanced Packaging.

For more information on our latest product technologies, visit us at Booth East 5-4.

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