MIRTEC to exhibit their award-winning 3D AOI and 3D SPI Systems at SMTAI 2017
MIRTEC, “The Global Leader in Inspection Technology,” will premier their award-winning 3D AOI and 3D SPI systems in Booth #606 at the 2017 SMTA International Exhibition. The exhibition will take place September 19-20, 2017 at the Donald Stephens Convention Center located in Rosemont, IL.
“MIRTEC will feature our award-winning MV-6 OMNI 3D AOI and MS-11e 3D SPI systems, as well as our all NEW MV-3 OMNI Desktop 3D AOI machine at this year’s event,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division. “Market demand for these revolutionary products have led to unprecedented growth of our organization. We are very excited about exhibiting at this year’s SMTAI event.”
The award-winning MV-6 OMNI 3D AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology which combines the 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary 8 Projection Digital Multi-Frequency Moiré 3D system in a newly designed cost effective platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s 8 Projection Digital Multi-Frequency Moiré Technology, provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to a 15 Mega Pixel Top-Down Camera.
The MS-11e 3D SPI Machine is configured with MIRTEC’s exclusive 15 Mega Pixel CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.
The machine uses Dual Projection “Shadow Free” 3D Moiré Technology combined with a Precision Telecentric Compound Lens and Precision Laser PCB Warpage Compensation to accurately characterize each solder deposition post screen print.
The MS-11e precisely measures solder volume, area, shape deformity and X/Y position and inspects for bridging between adjacent solder depositions. Furthermore, the MS-11e provides “Real Time” closed loop feedback to the screen printing system to effectively eliminate defects before they occur!
The all NEW MV-3 OMNI Desktop 3D AOI Machine is configured with MIRTEC’s OMNI-VISION® 3D Inspection Technology which combines our exclusive 15 Mega Pixel CoaXPress Industrial Camera Technology with our revolutionary 8 Projection Digital Multi-Frequency Moiré 3D system in a newly designed Desktop platform. Fully configured the new MIRTEC MV-3 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera making this system the most technologically advanced Desktop AOI machine in the world! There is little doubt that this new technology will set the standard by which all other inspection equipment is measured.
MIRTEC’s total quality management system software, INTELLISYS® also will be on display at SMTAI 2017. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.
“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” continued D’Amico, “We look forward to welcoming visitors to our booth #606 during the two-day event.”