Mycronic to demonstrate comprehensive line automation, dispensing and inspection solutions at SMT Hybrid Packaging 2018
Mycronic AB (publ) will showcase its growing range of next-generation jet printing, inspection, pick-and-place, dispensing and storage solutions for automated just-in-time electronics assembly at SMT Hybrid Packaging 2018 in Nuremberg (Booth 4-349, June 5-7). Inspection solutions became part of the product portfolio with the acquisition of Vi TECHNOLOGY, a leading provider of 3D automated optical inspection and solder paste inspection solutions. By combining 3D inspection with its latest pick-and-place and jet dispensing platforms, Mycronic can now offer the most complete line solution for tomorrow’s intelligent factory.
Growing range of solutions on display
Products on display at SMT Hybrid Packaging 2018 will include the new MY300 pick-and-place solution, MY700 high-speed jet printer for solder paste and assembly fluids, advanced 3D inspection systems, a new compact, high-capacity storage tower as well as the versatile MYSmart series for dispensing and conformal coating.
Automating for tomorrow – today
“Our latest product launches give manufacturers a fully integrated, state-of-the-art solution for virtually every stage of automated in-line assembly,” says Dr. Thomas Stetter, Sr VP and General Manager, Assembly Solutions. “At the same time, we are eagerly supporting broader industry efforts like Hermes and CFX, which will standardize the communication protocols needed to make Industry 4.0 possible. Inspection will be an important part of this evolution, since it creates valuable data that can be used not only to identify and eliminate defects, but to improve process performance in real time.”
The fully automated MYPro series production line
For the highest levels of SMT automation, Mycronic has introduced its next-generation MYPro series production line. Completely software-driven and operator-independent, the MYPro series combines comprehensive factory connectivity and real-time data into a single, fully automated production solution. The MYPro production solution comprises:
MY700 jet printer and dispenser, which jets both solder paste and a wide range of adhesive and assembly fluids at the industry’s highest speeds.
MY300 pick-and-place machines, which deliver higher real speeds and expanded feeder capacity within a 40% smaller machine footprint than previous generations.
MY700 – High-speed solder paste and adhesive jetting
The MY700 combines a new dual-lane, dual-head design with high-speed, state-of-the-art jetting heads. The dual-head design covers the widest possible range of solder paste dot volumes for small and very large components or can be configured to jet two different types of media. Thanks to a small machine footprint and advanced job balancing software, two MY700s can be placed side-by-side to work on the same product and to double the throughput. The MY700 twin-system is a state-of-the-art solution for applying solder paste, replacing stencil printers, in high-speed SMT assembly lines where perfect solder joints is a key requirement.
MY300 – Higher productivity with a 40% smaller footprint
The MY300, available in three models, expands capacity up to 224 feeder positions within a 40% smaller footprint than previous models. Higher real speed is enabled due to a number of performance enhancements including automatic conveyor width and job selection, as well as faster tool changes, which occur while the other head is mounting. Fully automated board train functionality is now standard, significantly increasing throughput due to simultaneous loading and unloading of multiple boards.
SMT line solution extended with next-generation 3D inspection systems
“Our recent acquisition of Vi TECHNOLOGY allows us to offer a fully integrated inspection solution combining high-precision metrology and advanced system intelligence,” says Robert Göthner, Sr VP and General Manager, SMT. “This makes it possible to view the full assembly process in real time, quickly drill down into defects and take immediate corrective action.” The offering includes the new PI series platform for 3D solder paste inspection (SPI), the K series for 3D automated optical inspection of circuit boards (AOI) as well as the ground-breaking software suite SIGMA Link for process management, analysis and optimization.
New higher-capacity SMD Tower 8000 storage system
To help assemblers cope with tighter floor space constraints and a need for increasingly efficient material handling, Mycronic will also unveil its latest near-production storage system called the SMD Tower 8000. The new unit is taller than previous models and allows for a 17% increase in reel capacity in the same footprint. The new tower provides an automatic, highly efficient cassette-free component retrieval system close to the production line for quick and smooth changeovers.
New MYSmart series for dispensing and coating
Finally, with the MYSmart series, Mycronic has significantly expanded its capabilities to become one of the world’s largest suppliers of advanced dispensing and conformal coating equipment for the electronics industry. For small-batch manufacturers, the series includes a range of cost-effective tabletop dispensing robots, which combine intuitive programming, easy customization and full scalability from advanced prototyping to batch production. At SMT Hybrid Packaging, Mycronic will exhibit the full portfolio of flexible MYSmart series solutions, covering all types of dispensing and coating applications.
To view the new MYPro series and MYSmart series, and to explore the advantages of Mycronic’s advanced automation solutions, next generation 3D inspection systems and improved SMD Tower 8000 storage system, visit Booth 4-349 at SMT Hybrid Packaging 2018 in Nuremberg, Germany on June 5-7, 2018.