A new fast acting IPA alternative for stencil cleaning will be available at NEPCON South China
KYZEN announced plans to reveal new research findings in Stand 1P01 at NEPCON South China, scheduled to take place Aug. 30- Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared during the event.
The evidence from this lengthy and objective study includes process videos and strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition. It concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable basis with engineered solutions, such as CYBERSOLV® C8882 than they are with standard IPA. In addition to sharing the results of the stencil reliability research findings, visitors to the KYZEN booth can acquire custom technical support to help reduce misprints and increase production yields at no cost.
CYBERSOLV® C8882 is a state-of-the-art IPA alternative for stencil cleaning. A fast-acting stencil cleaning solvent, C8882 is designed for the understencil wipe and hand cleaning processes. C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin, and low residue no-clean fluxes.
KYZEN also will feature its award-winning aqueous products, such as LONOX® L5611 and AQUANOX® A4625B.
With more than 25 years of experience and more than 50 industry awards, KYZEN connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem.
KYZEN®, AQUANOX®, CYBERSOLV® and LONOX® are registered trademarks in the United States and other countries.