New solder wire feeder at NEPCON South China
Metcal announced plans to exhibit in Booth #1H55 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Company representatives will show the Metcal USF-1000 Solder Wire Feeder, along with Metcal’s proven rework and repair equipment, including the Scarab Site Cleaning System, Scorpion Rework System, MX-5200 Soldering System and more. The new Metcal USF-1000 Solder Wire Feeder adds a new level of control and convenience to the soldering process.
The Scarab Site Cleaning System ensures accurate and repeatable cleaning of the component pad in one user-friendly system. Additionally, the Scarab addresses the industry needs with an automated system capable of cleaning component pads without contact. The system allows the user to add site cleaning capability to their operation without the investment of replacing their current component rework system.
The Scorpion redefines precision and addresses the technical demands presented by component manufacturers today. Metcal’s Automatic Placement Package is capable of 50mm of motorized travel in the Z-axis and a full 360° in ϴ (Theta). The Automatic Placement Package offers fine motor control in the Z-axis and ϴ during alignment of the component to the pad. The new force feedback control during the placement process enables the unit to accurately pick and place components without disturbing the component or solder.
The MX-5200 series features a dual-simultaneous use option, meaning that two hand-pieces can work from one power supply at the same time. The dynamic option enables the two hand-pieces to share 80 watts output power based on demand, adding even more application flexibility and speed. Four different hand-pieces and a comprehensive range of soldering and rework cartridges support the MX-5200 Series simultaneous dual operation. These include the Metcal Advanced™ Hand-Piece for SMD rework, a Metcal Ultra-Fine™ Hand-Piece for fine access, a Precision Tweezer capable of removing a range of components from 0201 chips to 28mm SOICs, and a Desoldering Gun for safely removing through-hole components.