New Viscom 3D AOI line-up and 360View feature for improved 3D inspection
Viscom announced plans to introduce its new 3D AOI line-up to Asian markets, highlighting its new 360View feature in Stand 1F35 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre.
With the whole line-up of the most advanced 2, 2.5 and 3D inspection systems on display, Viscom is taking a strong stand at this year‘s NEPCON South China Show. From manual 3D microfocus X-ray computed tomography, high precision wire-bond, and powerful 3D solder paste inspection, to fully automatic high-speed, in-line 3D AOI and AXI inspection, Viscom showcases the most reliable and efficient solutions for all test gates.
Better 3D with the new S3088 ultra blue with 360View
Introducing its new S3088 ultra 3D line-up, Viscom will premier the newly developed S3088 ultra blue in Asia. The new S3088 ultra blue features a combination of high quality and yet cost-efficient machine design. It comes preconfigured with one orthogonal and four angled view cameras that provide full 3D defect detection coverage for the most demanding components and solder joints.
The award-winning XM camera module easily delivers clear and accurate 3D color images. On top of that, with the new and unique Viscom 360View feature, the surface texture of components is now generated in unprecedented detail – not only on top of the components but also on all sides.
The S3088 ultra blue is the economic solution to ensure easy and reliable defect detection according to IPC standards. Additional advanced and special software or hardware configurations are available with Viscom’s S3088 ultra, including the top-level model S3088 ultra gold.