Nordson to exhibit full range of market leading test and inspection systems at SMT/Hybrid/Packaging 2016
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
Nordson DAGE is the market leading provider of award winning bond testing equipment and will be showcasing the second generation 4000Plus with camera assist automation which is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages and the 4000 Optima which is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.
MatriX introduces its latest addition to its #-series: The X3# flexible inline system designed for sophisticated high-speed 3D inspection on solder-joint level up to component inspection. This system features 4 advanced inspection technologies all in one: transmission X-ray technology with patented Slice-Filter-Technique™ (SFT), off-axis technology and 3D SART. These technologies present a flexible solution package for inline inspection of single and double-sided PCB assemblies with high packing density. The state of the art 3D software uses a dedicated number of angle projections for 3D reconstruction and delivers slice images needed for high quality 3D solder joint analysis. Thanks to the algebraic reconstruction method used (Simultaneous Algebraic Reconstruction Technique = SART) it is possible to generate 3D volumes for programmable slicing levels. Up to 6 slice levels can be generated automatically for high-resolution solder joint analyzing.
With its new X3# platform MatriX offers a combination of an optimized test concept with high speed transmission and selectively used 3D technique where needed.
The New FX-940 ULTRA 3D AOI from Nordson YESTECH incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads and co-planarity of chips, BGA’s and other height sensitive devices. The systems’ advanced 3D sensor provides industry leading metrology capabilities and shadow-free imaging at speeds of up to 8X faster than other systems.
Nordson YESTECH’s M1m AOI offering high-speed microelectronic device inspection with exceptional defect coverage will also be showcased. With 3 micron pixel resolution and telecentric optics, the M1m provides complete inspection.