Nordson showcases its market-leading test and inspection systems at SEMICON West
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce plans to exhibit in Booth #5644 at SEMICON West, scheduled to take place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The Nordson Test & Inspection team will showcase a suite of award-winning systems targeted at both the Semiconductor and PCBA markets, including the Quadra™ 7 X-ray Inspection system, M1m AOI system and 4800 Advanced Wafer Testing Bondtester.
Nordson DAGE’s flagship system – the new Quadra™ 7 with 0.1μm sub-micron feature recognition – comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP™ detector. 4K UHD offers up to 4 times the detail compared to standard HD display screens and supports 68,000X total magnification.
The Nordson YESTECH M1m AOI system offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submicron levels and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 m2.
The Nordson DAGE 4800 Advanced Automated Wafer Testing bondtester is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm.
Advanced technology guarantees unsurpassed accuracy and repeatability to provide total confidence in product quality. A range of powerful camera and optical systems optimize load tool alignment, auto programming and post test analysis make the 4800 system the pinnacle of automated wafer testing.
Representatives also will be available to discuss the XM8000 Wafer X-ray Metrology platform that takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more.