Optimize your reflow profile at the SMTA New England Expo Booth 604
KIC announced plans to exhibit at the New England Expo & Tech Forum, scheduled to take place Thursday, November 3, 2016 at the DCU Center in Worcester, MA. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”
Void reduction is a significant concern and controversial topic in electronic assembly. Voiding impacts electrical, thermal and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.
MB Allen is the Product Manager for KIC. As such she coordinates the advancement of new products and features to accommodate customer needs as KIC adds to its portfolio for the electronics industry. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in the future development, improvement and sales of the company’s product offerings. MB has worked in the electronics industry for nearly 30 years and been associated with KIC for 26 years with both national and international positions.
Additionally, KIC will demonstrate how its smart oven technologies lead to reduced production costs, higher quality and the new capabilities that the electronic assembly market demands. One exciting aspect of these smart technologies is that they are retrofitable on virtually all oven models at nearly any age. Now, the entire factory can use smart oven technologies.