PACE TF 1800 BGA rework system with revolutionary heater to be introduced at SMTA International

pace-tf1800_3000x2057px_12-sept-16PACE Worldwide announces the introduction of their new TF 1800 BGA/SMD Rework System, to be exhibited at the SMTA International Conference in Rosemont IL on Sept 27-28. The TF 1800 incorporates a groundbreaking top-side Inductive-Convection heater, which provides rapid heat-up and active cooling of the solder joints, resulting in faster throughput and greater process control. The patent-pending Inductive-Convection technology allows for an active cooling feature, which provides swift yet controlled component/PCB cool down, directly through the nozzle, yielding the highest quality joints. Its high efficiency, low thermal mass design takes far less power to operate and is more reliable than conventional heaters. An automated reflow head is driven by an advanced stepper motor, which provides smooth, ultra-precise, repeatable movement, with no drift, allowing for soft landing of components and 28μm (0.0011”) placement accuracy. In addition, an advanced vacuum pick/shaft design with optical sensor is counterweight balanced to eliminate placement pressure on components, and uses precision high temperature linear ball bearings for highest sensitivity in placement & pick-up. PACE’s exclusive adjustable height bottom- side IR preheater allows safe, closer proximity to the PCB for the most challenging high thermal mass boards. Other features include: an HD vision overlay system for optical alignment with quad-field imaging capability for placement of outsized BGA’s or large fine-pitch QFP’s; an integrated underside board support wand to prevent warping during reflow; and user-friendly software which guides operators through an intuitive interface that virtually automates the process. For more information, please visit our website.

www.paceworldwide.com

0

Start typing and press Enter to search