Photo Stencil presents its new technologies and manufacturing Capabilities for advanced stencil manufacturing at IPC APEX 2016 booth #825
Will honor Vice President of Technology Dr. William Coleman
Photo Stencil, LLC, a full-service provider of high-performance stencil printing solutions, will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016, Las Vegas, CO, March 15-17, 2016, in booth #825.
Photo Stencil’s technology focus has evolved with the industry and is now directed at the most advanced and challenging stencil applications. To manufacture these high-end stencils, Photo Stencil has recently moved into a new facility in Golden, Colorado which is equipped with cleanrooms, R&D labs, new plating lines, and precision fabrication equipment, including laser direct imaging (LDI). LDI enables the creation of extremely accurate stencils for solder paste printing of PCBs and for high density interconnects, BGAs, CSPs, and flex circuits.
In addition, Photo Stencil will be honoring its vice president of technology, Dr. William Coleman with a special event held during the show.
“Bill is a true expert in the field of stencils,” said Eric Weissmann, CEO of Photo Stencil. “He has provided his experience and knowledge to the electronic interconnect industry for over 30 years. IPC has awarded him the President’s Award for his ongoing leadership and significant contributions to the association and the electronic interconnect industry. He was instrumental in developing the IPC-7525 standard and has chaired the Solder Stencil Task Group Committee. Since he joined Photo Stencil in 1987 he has been an integral part in our technology and application development. We are thrilled to be able to honor him.”
To arrange a time to meet at IPC APEX or learn more about Photo Stencil, email email@example.com, call 719-599-4305, or check out the website.