How Problematic are Contaminants Left on Printed Circuit Assemblies?

An entire session is planned to tackle this subject at the Contamination, Cleaning & Coating Conference!
Contamination, Cleaning & Coating Conference
How Problematic are Contaminants Left on Printed Circuit Assemblies?
Residues trapped under fine pitch leadless devices are not visible and hard to inspect for. This session will build off of Session 1 to further characterize the nature of these residues. This session will work to answer the question as it relates to the chemical reliability of soldering residue.
These concerns will be addressed during Session 2 of the Contamination, Cleaning & Coating Conference, May 22-24, 2017 in Amsterdam, co-organized by SMTA and SMART Group.
Register soon – early registration discount ends on Monday, April 24!
By Attending This Session You Will Learn:


  • The use of Surface Insulation residue to qualify assemblies populated with fine pitch leadless devices
  • Are residues trapped under components “bad.”
  • Where do the sources of contamination come from?
  • Chemical reliability of soldering residue


Doug Pauls, Rockwell Collins
Surface Insulation Resistance Testing to Best Simulate Humidity Exposure and Potential for Leakage CurrentsDave Hillman, Rockwell Collins
Flux Residues under Components – Are they Bad?

Eric Camden, Foresite
Electronic Assembly – Where do Contaminants come from?

Bart van de Lisdonk, Interflux
Chemical Reliability of Soldering Residue

Who Should Attend the Contamination, Cleaning & Coating Conference?
The conference is ideally suited to design, production and quality engineers looking at future technology and maintaining a company technology roadmap. It’s vital to subcontractors to be up-to-date with new technology and its possible implementation along with material and equipment requirements for future customers.
Technical Program Overview
Tuesday, May 23, 2017

Keynote Address: Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers

Prabjit Singh, Ph.D. IBM Corporation 

Session 1: Residues Trapped under Component Terminations


Session 2: How Problematic are Contaminants Left on Printed Circuit Assemblies?

Session 3: Process Control and Cleaning Material Innovations


Wednesday, May 24, 2017

Keynote Address: Cleaning of Electronics – Analysing Cleaning Results and Potential Damage Risks when Cleaning Process is not Optimal

Ruediger Knofe, Siemens AG

Session 4: Conformal Coating Materials and Processes

Tanya Martin | | 952-920-7682 |



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