Register today for the Solder Reflow Fundamentals Workshop during SMTAI
BTU International, Inc., a supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, announces that Fred Dimock, Manager of Process Technology, will conduct a reflow workshop during SMTA International at the Donald Stephens Convention Center in Rosemont, IL. The workshop, entitled “Solder Reflow Fundamentals – Understanding and Obtaining Profiles,” is scheduled to take place Sunday, September 25 at 8:30 a.m. CDT in room 52.
This workshop is an expansion of the reflow portion of a workshop that was given at the American Competitive Institute in 2011 and was the basis of the reflow chapter in the SMTA Handbook of Electronic Assembly and A Guide to SMTA Certification by Ron Lasky etc.
This class will focus on the fundamentals of solder reflow and reflow oven operation. It is designed for new or current SMT engineers/technicians that are seeking a better understanding of the reflow process. Dimock will discuss recipes vs. profiles, heat transfer and oven control, why profiles are shaped the way they are and how to obtain profiles. Additional topics of discussion will include TC accuracy and mounting, profilers, test vehicles, eutectic vs. lead-free process windows, and process repeatability.
Dimock also will chair Session LF1 entitled, “Alloy Compositions for Enhanced Interconnection Performance,” scheduled to take place Thursday, September 29 at 8:30 a.m. CDT in room 47/49.
Dimock is the Manager of Process Technoly at BTU International and is a long-standing member of the SMTA Technical Committee. He holds an Associate’s Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred. (SUNY) His extensive experience in thermal processing includes positions at Corning, General Electric, and Osram-Sylvania before joining BTU.
Dimock has assisted many companies with process refinements and has authored numerous articles on lead-free solder, process control, and the operation of continuous furnaces. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.