Rehm is also taking part in international trade fairs in 2016

The specialist for thermal system solutions is presenting product innovations at the IPC APEX EXPO, the ElectronTechExpo and the AMPER

Rehm Thermal Systems will be represented at three major international trade fairs simultaneously in March this year. Under the motto “Power on! – Switch on and get started”, the Swabian machine builder is presenting the latest system technology from the areas of reflow soldering with convection and condensation, as well as new possibilities concerning circuit board coating in electronics manufacturing. Visit us from March 15 – 17, 2016 at the IPC APEX EXPO in Las Vegas or at the ElectronTechExpo in Moscow and from March 15 – 18, 2016 at the AMPER in Brno. Our on-site teams will be glad to assist you!

March 15 – 17, 2016: IPC APEX EXPO, Las Vegas
The IPC APEX EXPO is one of the most important trade fairs for the electronics industry in America. “Forward Thinking – For Tomorrow’s Technology”, the slogan for this year’s leading trade fair in Las Vegas, places the focus on innovative technological developments of the future. For this purpose, at Booth 1569, Rehm is presenting the latest thermal system solutions which can optimally be integrated with numerous features into any production environment, including VisionXC for reliable convection soldering processes and Protecto for the best conformal coating applications. Paul Handler, General Manager of Rehm USA, will be glad to assist you with the systems on site. In addition, Helmut Öttl, Application and Process Development at Rehm, will lecture at a conference on the “Influence of miniaturisation on the reflow process – complex boards” (Wednesday, March 16, 2016, 10:30 a.m. – 12:00 p.m., Room S226).

March 15 – 17, 2016: ElectronTechExpo, Moscow
With its recently established branch in Moscow, Rehm will also be able to respond in the future to the needs of the Russian electronics market as well as be represented at the main trade fairs and technology events. For example, we will be at the ElectronTechExpo in Moscow for the first time this year! At our Booth A127, we will be presenting our new Protecto system for highly selective circuit board coating, as well as the CondensoXS Vac, an all-round system for reflow soldering condensation with minimum space requirements. At Booth A205 of our partner Global Engineering, we will also present our VisionXC for the optimum reflow convection soldering of small batches.

March 15 – 18, 2016: AMPER, Brno
The AMPER in Brno is one of the largest trade events for the electronics industry in Europe. The industry’s leading companies participate in the fair to present their product portfolio in the fields of electrical and radio engineering, automation, building technology and communications to a broad audience. Rehm Thermal Systems can be found at Booth F 2.26, where we will present our VisionXC. We are looking forward to your visit!

Information on the exhibited systems:

01 VisionXCVisionXC – Ideal reflow convection soldering system in a compact design
Small batch sizes? Low throughput? For every electronics manufacturer, it is important to achieve high quality in the manufacturing of components even at low throughput. This demand requires optimum processes for reproducible soldering results, which have to be implemented over the long term and without compromising. It is precisely for these customers that the VisionXC was designed. It is impressive with its compact design, which combines all the important technological properties in the smallest space. The VisionXC is the ideal convection soldering system for small and medium-sized batches in production, in the laboratory or for demo lines.

02 ProtectoProtecto – Highly selective conformal coating applications
You can increase the quality and lifespan of your products with the use of protective coatings. The Protecto selective conformal coating system by Rehm protects sensitive electronic components from damage due to corrosion or other environmental influences, such as moisture, chemicals and dust. With the multifunctional paint applicator, even complicated application processes are possible in a single work step, and even in tight spaces between the components. The use of up to four nozzles means your coating options are completely flexible. The system is also available as a line concept with paint dryer in order for production to be designed even more efficiently.

03 CondensoXSCondensoXS – High performance in the smallest of spaces
Efficient condensation soldering processes are possible in the smallest space with the CondensoXS. The system has significantly less of a footprint. Your advantage: 25 % less space required for the same process characteristics. Use of the injection principle and controlling the temperature and pressure ensure an accurate and diverse reflow profiling. Void-free soldering can be implemented in all systems of the CondensoX series with the vacuum option.


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