Revolutionary AOI, AXI and & Bondtesting from Nordson at NEPCON South China
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.
The Nordson DAGE Quadra™ 5, with industry-leading core technology, offers high performance and ease of use for 2D and 3D X-ray applications. 0.35μm feature recognition up to 10 W of power, makes the Quadra™ 5 the leading choice for printed circuit board and semiconductor package inspection.
Nordson DAGE also will highlight its award-winning 4000Plus Bondtester with Camera Assist Automation, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.
Nordson MATRIX presents an excellent inline solution with its X#-series systems. This modular automated inspection platform is designed for flexible, high-speed inline X-ray inspection. The platform features up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter- Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART. The exhibited X2.5# system allows high-speed off-axis image acquisition from different angles and presents a reliable solution for the inline inspection not only of double-sided PCB assemblies but a wide range of various applications (e.g. SMT, Power Hybrid inspection, battery inspection).
Nordson YESTECH’s FX-940UV makes inspection of conformal coatings simple and convenient by automating the inspection process. The system inspects for quality and consistency of coating coverage under proprietary ultra violet lighting with the use of proprietary inspection algorithms. An optional coating thickness measurement package also is available.