Session 1 of IPC-SMTA Conference to Focus on Cleanliness Considerations

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.

Session 1 of the Technical Conference focuses on “Cleanliness Considerations for Building Reliable Hardware.”
Mark McMeen of STI Electronics will discuss improved methods for “qualifying soldering and cleaning processes that result in acceptable levels fo flux and other residues.”

Ravi Parthasarathy of Zestron Corporation will discuss “Jet Printing Cleaning Challenges,” test methods and best practices for cleaning these assemblies.

Doug Pauls of Rockwell Collins will discuss “Development and Validation of an SIR-Based Process Evaluation System and Methodology” for determining acceptable cleanliness levels.

Axel Vargas of Lockheed Martin Missel System will discuss “ Methods for Developing and Validating Rinsing Electronics devices following the Cleaning process in both batch and inline cleaning machines.”
Vladimir Sitko of PBT Works will discuss “Visual Methods for Determining Time to Clean Flux Residues under Leadless and Bottom Terminated Components.”

Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.
The link http://events.ipc.org/events/ipc-and-smta-high-reliability-cleaning-conformal-coating-conference/event-summary-3940b66bd507411cbf7136cb9644c84b.aspx provides a detail agenda outline.

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