SHENMAO America, Inc. exhibits November 14, 2016 at MEPTEC Semiconductor Packaging Roadmap Symposium introduces semiconductor packaging materials
SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon.
SHENMAO America, Inc. blends Solder Paste in San Jose, CA with Tin smelted from Tin Ore concentrate creating ultrapure virgin powder made at its Facility in Taiwan for distribution in North America and 9 other locations world wide.
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