SHENMAO America to participate in the eSMART Factory Conference

SHENMAO America, Inc. today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.

SHENMAO’s PF606-P245 is designed to lengthen stencil life and eliminate head-in-pillow (HiP) defects, voids, slumping and non-wetting opens. Minimal flux residue gathers near the outside of the solder joint on the PCB substrate – a substantial improvement over legacy solder paste. With superior continuous high-speed printability, the pastes produce first-rate solder paste print quality and a wide reflow process window for excellent solderability.

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America. For more information, please visit


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