SHENMAO to Debut New Solder Wire for Automatic Soldering Equipment at APEX

SHENMAO America, Inc. is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.

SHENMAO PF606-F13 Solder Wire.JPG

SHENMAO’s PF606-F13 lead-free and halogen-free solder wire is designed for automatic soldering equipment. It improves the working environment for a variety of automatic soldering applications, including: TPC soldering, buzzer, bending element, LCD panel, embedded element, solder joints, wire soldering, button, screen connector and FPC soldering. Benefits include:


  • Improve workers’ working environment
  • Reduce the technical requirements of manual operation
  • Enhance high-precision soldering
  • Stable soldering quality
  • Enhance soldering efficiency
  • Mass production


PQ10 series low temperature solder paste is made with the modified Sn/Bi alloy with lower melting point range from 137~142°C to 137~170°C. In comparison with SnAgCu, PQ10 offers reduced peak reflow temperature, energy consumption, and warpage of PCBs and components. In comparison with the Sn42/Bi58 Eutectic alloy, PQ10 series offers better ductility, finer microstructure, and increased drop and thermal reliability.

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.


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