Sherlock temperature-based FEA receives IPC APEX Innovation Award
For outstanding product to the electronics industry
DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that the newest version of Sherlock Automated Design Analysis™ Software version 5.4 with Temperature-based FEA with, has been awarded an IPC APEX EXPO Innovation Award. The IPC APEX EXPO Innovation Awards have been created to honor outstanding products and services for the electronics industry. The award was presented to DfR Solutions at the IPC APEX EXPO during John Mitchell’s keynote on Wednesday, February 28, 2018.
About Sherlock’s Temperature-Based FEA
In extreme environments like aerospace and automotive, electronics reliability is critical to the performance of the product and the safety of its users. Available this March, the new Temperature-based FEA capability, will enable users to simulate boards experiencing thermal and vibrational stresses sequentially, modeling to real-world conditions where products are exposed to many stressors simultaneously.
As part of the award submission, DfR Solutions answered the following questions:
How is this product innovative?
Sherlock Automated Design Analysis Software is the only Physics of Failure (POF) based electronics design reliability analysis tool that analyzes and predicts product failure before it happens. Continually evolving, this version of Sherlock allows users to predict not only board-level but component-level reliability and make critical lifetime predictions based on real-world conditions. This is crucial to industries like automotive and aerospace that operate in extreme environments.
How is this product impacting the industry?
Sherlock is being used by Fortune 100 companies across all industries to streamline and accelerate new product development, saving time, money, reducing cost, and increasing customer satisfaction. Sherlock is quickly becoming the tool that is required by major manufacturers throughout their supply chain.